As microprocessors become smaller and faster, heat dissipation and the need
for environmentally friendly electrical interconnect materials have emerged as
a major technology challenge. Honeywell Electronic Materials has established
itself as a prime supplier in electrical and thermal interconnect products for
semiconductor packaging in the high performance segment of BGA packages.
Honeywell Electronic Materials' core competencies include the production of
the high purity evaporation charges and electroplating anode products that are
currently used for under bumping and wafer bumping of flip chips. In addition,
Honeywell is the leading supplier of low alpha Pb products required for high
performance flip chip MPU's.
Thermal spreaders, lids and stiffeners are used in flip chip, EBGA and TBGA
packages for thermal management, die protection and mechanical support.
Depending on the type of device package, the heat slug serves as the base on
which the IC is mounted. It draws heat from the reverse side of the die for
ambient dissipation or via an attached heat sink in higher performance
applications.
Thermal interface materials are used to fill air pockets and gaps between
the die and various thermally conducting components such as spreaders, plates,
and heat sinks. The selection of the interface material is critical to the
performance of the device and must take into account a variety of performance
characteristics.
