Helps meet growing demand for effective solutions to manage heat produced by advanced semiconductors.

MORRIS TOWNSHIP, N.J., March 16, 2009 - Honeywell (NYSE: HON) announced today that it has developed a new thermal interface material to help manage heat produced by advanced semiconductors.

The new product, called Honeywell PTM 3180, uses high-performance polymers and tailor-loaded filler technology to help optimize thermal performance, while making it easier for customers to store and work with the material.

"We are committed to sustaining leadership in thermal management technology to help customers meet the challenges of dealing with increasingly powerful and smaller semiconductors," said Dr. Tim Chen, global business director for packaging for Honeywell Electronic Materials. "This new thermal interface material offers the ease of use and processing advantages over many current thermal materials, while providing superior handling and re-workability."

As semiconductor chips become more powerful and smaller, more heat is being generated in a confined space when semiconductor chips are packaged for use in computers and other applications. This tremendous heat can damage the semiconductor or degrade its performance. Honeywell's thermal management materials are designed to help dissipate this heat by filling the gap between the semiconductor chip and the heat spreader.

Honeywell PTM 3180 is a highly thermally conductive Phase Change Material (PCM), which remains solid at room temperature for the ease of application. It becomes semi-fluid when exposed above a certain temperature, providing excellent wet-out characteristics to fill the surface irregularities and air gaps between the heat spreader and the chip.

Based on a novel polymer PCM system, the new material exhibits excellent wetting characteristics at interfaces during typical operating temperature ranges, minimizing contact resistance and enhancing heat dissipation. It is designed to, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost. The material is available in both pad and dispense formats.

"This new product adopts our proprietary formulation, which meets the multiple challenges for thermal materials such as robust thermo-mechanical reliability performance, excellent compressibility for gap filling and warpage control, and no pump-out or degradation after power cycling," said Chen.

Honeywell PTM 3180, which exhibits phase change at 45 degrees Celsius, was developed to create the interfacial performance required for the entitled thermal conductivity and designed to effectively reduce the surface contact resistance. Product delivery mode can be tailored to application. Current offering is roll format taped pads of 10 mil (0.025 mm) thickness supplied between liner films.

Honeywell Electronic Materials, a part of Honeywell Specialty Materials, supplies microelectronic polymers, electronic chemicals, and other advanced materials that enable the integration of cutting edge processes at customer sites. Honeywell also maintains extensive product offerings under its metals business segment, including physical vapor deposition (PVD) targets and coil sets, precious metal thermocouples and materials used during back-end packaging processes for thermal management and electrical interconnect. More information can be found at http://www.honeywell.com/em/.

Honeywell International is a $37 billion diversified technology and manufacturing leader, serving customers worldwide with aerospace products and services; control technologies for buildings, homes and industry; automotive products; turbochargers; and specialty materials. Based in Morris Township, N.J., Honeywell's shares are traded on the New York, London and Chicago Stock Exchanges. For additional information, please visit www.honeywell.com.

This release contains "forward-looking statements" within the meaning of Section 21E of the Securities Exchange Act of 1934. All statements, other than statements of fact, that address activities, events or developments that we or our management intend, expect, project, believe or anticipate will or may occur in the future are forward-looking statements. Forward-looking statements are based on management's assumptions and assessments in light of past experience and trends, current conditions, expected future developments and other relevant factors. They are not guarantees of future performance, and actual results, developments and business decisions may differ from those envisaged by our forward-looking statements. Our forward-looking statements are also subject to risks and uncertainties, which can affect our performance in both the near- and long-term. We identify the principal risks and uncertainties that affect our performance in our Form 10-K and other filings with the Securities and Exchange Commission.

Contacts:
Peter Dalpe (U.S.)
973-455-4908
Peter.Dalpe@honeywell.com

Alexandra Pribilovics (Asia)
+86 (21) 2894-2932
Alexandra.Pribilovics@honeywell.com