Builds On Technology Leadership in Thermal Management

MORRIS TOWNSHIP, N.J., March 15, 2010 – Honeywell (NYSE: HON) Electronic Materials announced today a new printable thermal management material designed to help manage the tremendous heat produced by increasingly powerful semiconductors in portable computing devices such as laptops and netbooks.

Honeywell is a recognized leader in developing thermal management solutions that transfer and dissipate heat, and the new material, Honeywell PCM45M-SP, builds on Electronic Materials’ existing line of thermal management materials. As semiconductors become more powerful and smaller, more heat is being generated in the confined spaces where semiconductors are packaged for end-use applications. This tremendous heat can damage the semiconductor or degrade its performance, and it can damage the device as well.

“Mobile computing devices such as laptops and netbooks are placing increased demands on thermal management materials to enable high performance and ensure a long lifespan,” said Tim Chen, packaging leader for Honeywell Electronic Materials. “To meet that challenge, we have combined our industry leading phase-change chemistry with an innovative formulation specifically designed for these types of mobile devices.”

In typical mobile computing applications, chip temperature rises steeply at start-up and remains high during operations. PCM45M-SP is designed to meet these specific thermal management requirements, delivering reliable power cycling performance where other thermal materials would typically fail.

PCM45M-SP can withstand more than 1,000 hours at 150˚C without degradation and more than 1,000 temperature cycles. The application is not limited to heat sink design, and the material may be applied to a component, heat sink or thermal spreader in any shape built into the printing screen. Additionally, the enhanced stability of this new material minimizes or eliminates the need for pre-mixing, conserving time and resources.

The PCM45M-SP phase change thermal interface consists of a sophisticated thermally conductive material with optimum filler size distribution to achieve maximum packing density compared with conventional phase change materials. PCM45M-SP changes phase at 45˚C to ensure maximum surface conformance.

Honeywell Electronic Materials, part of Honeywell Specialty Materials, supplies microelectronic polymers, electronic chemicals, and other advanced materials along with an extensive set of product offerings under its metals business segment, including physical vapor deposition (PVD) targets and coil sets, precious metal thermocouples, and materials used during back-end packaging processes for thermal management and electrical interconnect.

For more information, visit www.honeywell.com/em.

Honeywell Specialty Materials is a global leader in providing customers with high-performance specialty materials, including fluorine products; specialty films and additives; advanced fibers and composites; intermediates; specialty chemicals; electronic materials and chemicals; and technologies and materials for petroleum refining.

Honeywell International (www.honeywell.com) is a Fortune 100 diversified technology and manufacturing leader, serving customers worldwide with aerospace products and services; control technologies for buildings, homes and industry; automotive products; turbochargers; and specialty materials. Based in Morris Township, N.J., Honeywell’s shares are traded on the New York, London, and Chicago Stock Exchanges. For more news and information on Honeywell, please visit www.honeywellnow.com.

This release contains certain statements that may be deemed “forward-looking statements” within the meaning of Section 21E of the Securities Exchange Act of 1934. All statements, other than statements of historical fact, that address activities, events or developments that we or our management intends, expects, projects, believes or anticipates will or may occur in the future are forward-looking statements. Such statements are based upon certain assumptions and assessments made by our management in light of their experience and their perception of historical trends, current economic and industry conditions, expected future developments and other factors they believe to be appropriate. The forward-looking statements included in this release are also subject to a number of material risks and uncertainties, including but not limited to economic, competitive, governmental, and technological factors affecting our operations, markets, products, services and prices. Such forward-looking statements are not guarantees of future performance, and actual results, developments and business decisions may differ from those envisaged by such forward-looking statements.

Media Contact:
Peter Dalpe
973-455-4908
peter.dalpe@honeywell.com